Wolfspeed has launched commercial production of optical-quality transparent silicon carbide (TSiC™) wafer technology; 150 mm and 200 mm substrates offer a scalable platform for solid-state spin qubits, low-loss quantum photonics, and cryogenic packaging. The technology represents a milestone in the quantum hardware supply chain by providing a scalable alternative to diamond for wide-bandgap quantum devices.
Wolfspeed Commercializes Transparent Silicon Carbide Substrates for Quantum Computing and Integrated Photonics
Wolfspeed's 4H-SiC technology overcomes the scaling limitations of diamond substrates, enabling CMOS-compatible manufacturing for quantum spin qubits and photonic integration.